R&D Engineer II - Thermal

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Date: May 7, 2024

Location: Zhubei City, Hsinchu County, TW, 30288

Company: Ansys

Summary / Role Purpose  

The R&D Engineer II for foundry support contributes to the support of Ansys products enablement with worldwide foundries. In this role, the R&D engineer II will collaborate with a team of expert professionals to understand foundry technology requirements and accomplish solution enablement objectives. 

 

Key Duties and Responsibilities 

  • Performs moderately complex development activities, including the design, implementation, maintenance, testing and documentation of software modules and sub-systems 

  • Understands and employs best practices 

  • Performs moderately complex bug verification, release testing and beta support for assigned products. Researches problems discovered by QA or product support and develops solutions 

  • Understands the marketing requirements for a product, including target environment, performance criteria and competitive issues 

  • Understand foundry technology requirement, defining spec and work with RD to enable the solution.  

  • Support foundry technology collaboration with Ansys solution, including certification, reference flow, and mutual customer support 

  • Works under the general supervision of a development manager 

 

 

Minimum Education/Certification Requirements and Experience 

  • BS in Engineering, microelectronics, mechnical, or related field with 1-3 years’ experience or MS 

  • Working experience with EDA solution, EDA companies, semiconductor design companies, semiconductor foundries. 

 

Preferred Qualifications and Skills 

  • Technical knowledge and experience with ASIC design flow, VLSI, RC extraction, device simulation, and/or CAD engineering. 

  • Experience with Ansys tools, is a plus, but is not required. 

  • Expertise in scripting languages like python, perl, TCL desired 

  • Good communication and interpersonal skills 

  • Ability to learn quickly and to collaborate with others in a geographically distributed team. 

  • Experience in 3DIC or system-level thermal/stress simulation is a plus. 

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