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Lead Product Specialist

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Date: May 11, 2022

Location: Chengdu, CN, 610042

Company: Ansys

SUMMARY

 

This engineer will join the Product Management team that focus on CPS Thermal product development and customer support. 

 

Innovation in semiconductor design and manufacturing enables smaller device architectures with higher performance and energy efficiency for powering the smart product revolution. The physics associated with shrinking geometries, especially in the emerging 3-D IC, FinFET and stacked-die architectures, bring out design challenges related to power and reliability, affecting design closure. ANSYS simulation and modeling tools offer the sign-off accuracy and performance needed to ensure power noise integrity and reliability of even the most complex ICs, taking into account electromigration, thermal effects and electrostatic discharge phenomena.

 

RESPONSIBILITIES

 

  • Develop hands-on technical expertise on the ANSYS semiconductor products
  • Lead user testing of new features, publish results to drive productization, and review product documentation, working with the extended product engineering and field teams
  • Develop prototype solutions and scripts for customer needs to enable a differentiated product
  • Participate in creating requirement specs for new features by working closely with field and customers
  • Lead customer beta evaluations for significant new functionality, leading to successful deployment in customer design flow
  • Develop and deliver product training, application notes, and other technical collateral working with field to enable customer deployment of new features
  • Author articles and blogs to promote and advertise product. Prepare, conduct, or assist in conducting product presentations and demonstrations
  • Participate in product presentations and demonstrations at customers and tradeshow
  • Create unit, regression and/or system-level tests to thoroughly validate new features or changes.

 

MINIMUM QUALIFICATIONS

 

  • BS degree in Electrical Engineering or related field with 8 years’ experience, MS with 6 years’ experience, or PhD with 4 years’ experience
  • Significant experience in 3DIC or system level thermal/mechanical simulation
  • Familiar with hardware design and chip package structure of electronic products, have experience in thermal design or thermal simulation analysis, familiar with thermal simulation analysis from chip level to system level using Ansys Icepak/Workbench or other thermal simulation tools
  • Working knowledge of the Linux operating system
  • Solid theoretical foundation in heat transfer theory and multi-physical field coupling simulation, Familiar with the domestic and foreign standards related to thermal design and thermal testing
  • Ability to learn quickly, analyze and solve complex problems,  and work closely with others
  • Ability to complete high-quality work on time

 

PREFERRED QUALIFICATIONS

 

Demonstrated skills in the following areas are a plus:

  • Familiar with Ansys Icepak/Workbench and other thermal simulation tools
  • Multi-physics background, e.g. EM, thermal, stress analysis
  • Experience with the Python programming language
  • IC physical design